Utilizing many years of experience nad application of today&＃39;s state of the art colling technology, purposed to provide industry leading solution for managing all thermal problems in today&＃39;s electronic devices and telecommunications equipment, TTM(Top Thermal Management Co., Ltd.) was founded in 2004 in Korea. As industrial elecronic devices and elecric home appliances continue to advance and increase in complexity, the conventional cooling mechanism based on heat sink in quickly reaching its limits. In response to this demand for better and more effective cooling system, TTM strive to provide optimal heat management solution through continued excellence in research and development.At TTM, we have the thechnological know-how to further advance conventional heat dissipation mechanism typically based on Heat Sink and Heat pipe. Furthermore, we continue to strive to provide optimal heat management solution by using next generation Nano/Micro technology.