ANST has whole assembly and test lines and 3000 set main machines. The assembly building is 25000 square meters and test building is 10000 square meters. ANST has world-class IC assembly process and analog, digital and mix-signal test process. After several years development, ANST has over 100 packages including DIP, SOP, SSOP, MSOP, QSOP, TSOT, QFP, QFN and Flip chip. Basing on developing traditional IC assembly and test technology, ANST focus on developing advanced assembly research and development. We developed 50um 12inch wafer backgrinding and sawing process, high density gold wire and copper wire wire bonding process, OCDIP, OCSOP, MEMS, FC-SOICFC-TSOTFC-QFN etc., and have many intellectual property.